MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.133 INCHES NOMINAL |
ADAT | BODY WIDTH | 1.133 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.135 INCHES NOMINAL |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BURN IN, MIL-STD-883, CLASS B AND HERMETICALLY SEALED AND LOW POWER |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | HI-PERFORMANCE MOS |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROPROCESSOR LOW POWER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL INPUT/OUTPUT DIFFERENTIAL |
TTQY | TERMINAL TYPE AND QUANTITY | 68 FLAT LEADS |