MRC | Criteria | Characteristic |
---|---|---|
ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
TTQY | TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
ZZZK | SPECIFICATION/STANDARD DATA | 80131-2N2218 PROFESSIONAL/INDUSTRIAL ASSOCIATION STANDARD |